Your partner for SMD and Final Assembly
NEW! MVA Modular Automatic Packing System
Standard system for an automated (re)packing of electronic or mechanical components out of several different packaging types into pocket tapes, JEDEC trays or waffle packs. The automated packing system has a modular structure and can be equipped on request with
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Label Feeder Slimline / Mediumline
Automatic labelling by label feeder is a cost-effective and simple solution, also for integration in special machines. Our feeders are available with corresponding adaptations for a wide range of pick-and-place machines, such as ASM, Fuji, Juki, Mycronic, K&S and Yamaha.
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Labels & Die Cut Parts
We can also supply you with the appropriate labels or pre-cut cover foils (Die Cut Parts) for our label feeders and label cells. We offer a wide range of UL, cUL and CSA certified label materials – you are sure
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Reflow Inline Video Camera
The Uisys HiCam is a reflow QM system that combines temperature and vibration measurements with camera recordings for the first time. In contrast to AOIs, which come into play after the reflow process, defects can thus be precisely traced back
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Optical Bonding
Optical bonding with OCA Tape (Optical Clear Adhesive) is used for a wide range of electronic components. Current technology and market trends show that there is a rapid increase in products that require touch panels. These include devices for the
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PLACE-N-BOND Underfilm
THE Alternative to the Underfill Process The thermoplastic produced in the USA is used to improve solder joints and to increase the shock absorption of SMT components such as BGA, LGA and CSP on your PCBs. Supplied in pocket tapes,
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