Automatic Die Attach Tabletop
The unmatched versatility of this die attach system allows a wide range of cold and heated die attach processes to be performed with the same machine.
The implemented process capabilities include: Epoxy Die Attach, various eutectic processes, GGI based on ultrasonic or thermo Compression processes, ACF/ACP, Ag sintering, die stacking and many other processes.
The very high placement accuracy of at least 3 µm (process-dependent) is ensured by the precise servo systems, the high-resolution digital image processing system and by the machine's advanced Windows-based software.
Active and passive components can be processed and fed in 2″- and/or 4″-waffle/gel packs, tape & reel feeders of various sizes and customised trays. Various systems are optionally available for applying the adhesive.
The system has a unique die stacking capability with programmable BLT (Bond Line Thickness), as well as full flip chip capability for solder, gold and other bump materials.
The MAT 6200 is the ideal solution for optimal handling of high-mix applications with minimal changeover time.
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