SMT II
Low Static Cleaning System
Teknek's SMT-II sets new standards for cleaning SMT printed circuit boards.
With extremely low static and low-pressure cleaning, the SMT-II provides the perfect method for removing contaminants prior to paste printing.
Specifications
| Two cleaning widths | 40 – 400 mm 40 – 600 mm |
| Operation modes | Double side cleaning and bypass or single side cleaning and bypass |
| Elastomer rollers | NTTM- or UTF-NanocleanTM |
| Adhesive rollers | AREP or AREF |
| Progressing speed | 1-40 m/min. |
| Pass line height | 900 +/-50 mm |
| Power supply | 85-265Vac |
| Pneumatic pressure | 5-7 bar oil free compressed air |
| ESD compatibility: | |
| Machine | ANSI / ESDs 6.1-2014 & IEC 61340-5-1 2016 |
| All rollers | ISO 6123 Class A |
| NT™/NanocleenTM 20.20 | ANSI / ESDs 20.20-2014 |
| Adhesive | FINAT |
